Agilent tips solutions for TDD-LTE designs

Agilent has launched a fully coded BER solution for the time division duplex version of 3GPP's LTE standard using 2 x 2 and 4 x 4 MIMO technology.

DRAM vendors redesign market strategies

Despite an oversupply that has led to severe price erosion over the past year, DRAM makers are determined to pursue the latest innovation to achieve an edge over their competitors.

Understanding common-mode signals

To understand how common-mode signals are created and then suppressed, you should first understand the interaction of shields and grounds in common cable configurations. The following discussion defines a common-mode signal, reviews the common cable configurations, considers shielded vs. unshielded cables, and describes typical grounding practices.

Networked MCUs

Explore key issues about networked MCUs.

The questions and answers focus on the hardware and software used to create a network-enabled device. Some general questions about networked microcontrollers are also answered.

Teardown reveals Android phone BOM cost

A virtual teardown conducted by iSuppli Corp. estimates that the BOM cost of T-Mobile G1 smart phone, the first wireless handset to be based on Google Inc.'s Android mobile OS, reached $143.89.

STM32: a Class B ready MCU
platform

Home appliances have to comply with IEC60335, which is intended to prevent malfunction in case of fault condition. Depending on the class (A/B/C), MCU components have to be tested at power on and monitored during run-time for safety critical applications.

Aim for compact, high-efficiency AC/DC supplies

Like most electronic systems, power supplies continue to get smaller. Smaller designs are achieved by combining a range of techniques, rather than through dramatic technology breakthroughs. It's the skill of the designer that separates a very good power supply from an average one.

Implement OFDMA, MIMO for WiMAX, LTE

Sam Jenkins of picoChip discusses how to implement the core DSP algorithm of OFDMA, then the novel variant used by LTE for the uplink, and finally a brief discussion of MIMO for both WiMAX and LTE.

The art of Mobile WiMAX testing

The latest version of the WiMAX standard addresses the mobile services required to free users from the tethers of a predetermined location. As with any new technology comes the need to test its hardware.

Choose the right architecture for mobile WiMAX

WiMAX continues to grow in popularity, and the solidification of the 802.16 standard has ensured that the technology will be around for the long haul. As the fixed 802.16d standard becomes more readily available, the focus turns to the mobile aspect of WiMAX.

Embedded developers make OS choices

Here's the second installment of a two-part report of Embedded Systems Design magazine's 2008 Embedded Market Study results.

iSuppli: Setbacks in some China IC firms linger

More than 550 fabless semiconductor companies are competing in China today, but about 100 of them will close shop within the next two years, says iSuppli.

• CPT says no plans to shut down LCD fab
• Sony says Blu-ray sales short of forecasts
• Taiwan IC production value down 6.5% in 2008
• Downturn won't mean "full stop" on tech spend
• Investors Shrug off Spansion Lawsuit vs Samsung
• Analyst: 'big 'bang' to hit PC and handset industry
more headlines

How to grow an electronics giant

How Samsung made the transition from a CE dwarf to a global brand is a well-told story. Over the past decade, Samsung has ascended to the status of media darling and envy of the industry.

Fab tech roll call: survival of the fittest

Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze.

Explore NAND flash implementation options

Several factors are contributing to the challenges of designing NAND flash memory subsystems. Presented in this article are different NAND flash implementations.

AMD regains market standing with Shanghai processors

AMD redeems itself with its latest 45nm Shanghai processor driving an uptick in sales in high-end server markets, based on some integrators.

AMD seeks to add more fabs in Germany

AMD is expected to expand its production lines and future foundry service providers such as Fab 36 and Fab 38 in Dresden, Germany.

Solar markets: Highlighting PV technology

It has been shown that solar energy harvesting will soon go mainstream, but it's not clear which of the many diverse technologies vying for dominance in this emerging market will take precedence.

iSuppli: Polysicon price to slide starting next year

iSuppli forecasts that the pricing for polysilicon used to create PV cells is expected to drop in 2009 and the following years due to fundamental imbalances in the solar supply chain.

MEMS tech brings inroads in consumer devices

As MEMS technology steadily gets integrated into consumer devices, it could soon make a giant step toward the so-called 'lifestyle products, where MEMS chips could provide more manageable interfaces.

MEMS chips up for innovation despite slowdown

MEMS chips are still being immersed into diverse consumer applications, according to the MEMS Executive Congress.

Qualcomm steps up to reach top 10 IC suppliers

Qualcomm has devised a 27-percent year-over-year growth rate to jump to ninth place among the largest IC suppliers in the first three quarters of 2008, according to Insights Inc.